New approach based on low-cost standard microelectronic manufacturing technology

Highlights

• Novel three-dimensional surface structure suitable for silicon solar cells with either crystalline or multicrystalline substrates and thickness greater than 25 micrometers increases efficiency by about 30 percent. The technology may be adapted to different methods of substrate manufacture.
• The approach is based on standard, silicon solar cell, manufacturing technology
• Theory based on basic principles of semiconductor devices expected to yield proposed results

Our Innovation

Novel three-dimensional geometry on the silicon surface combined with optimized doping profile and contact electrodes produces 30 percent increase in efficiency using standard microelectronic manufacturing technology.

Key Features

• Based on standard manufacturing technology.
• Increase in efficiency with mildly increased cost.
• Solution for weakly absorbed red and IR light ensures higher collection efficiency.
• Suitable for both crystalline and multi crystalline silicon.
• Significantly reduced series resistance and metal shading losses.

Development Milestones

• Expecting first samples from foundry.

The Opportunity

• Silicon wafer-based solar cells currently account for more than 86 percent of the commercial solar cell market.

Published US 2011/0162699 A1