Burtman Vladimir, HUJI, Faculty of Science, The Institute of Chemistry
Self-assembling molecular layers for microelectronic components
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Categories |
Organic semiconductors, Nanotechnology, Microelectronics |
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Development Stage |
Lab. Demo: OLED, OFET, and Biosensing |
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Patent Status |
U.S. patents 6,316,098, 6,783,849, 6,808,803 |
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Market Size |
The flat panel display industry is forecast to reach $100 billion by 2009 |
Highlights
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This unique film process is a breakthrough technology, enabling organic layers of molecular thickness to be laid directly on a silicon die without loss of performance and with stable electronic properties for the mass production of inexpensive, advanced semiconductors
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Provides a solution for the problems of power consumption, heat generation, and microstructures’ switch leakage in smaller and higher-quality transistor structures for faster, more sensitive and more efficient microprocessors for mainframe and personal computers, PDA and cellular devices, and flat-panel displays.
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For next-generation, high-end microprocessors, the processes are compatible with both silicon technology and organic electronics.
Our Innovation
Key Features
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Semi-conducting films 100,000 times thinner than current standards
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High electron mobility higher than other organic films - significantly enhancing existing products, while enabling novel high-performance devices
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Can reduce operational costs by up to 90%
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Greater than 98% yield
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Allows for creation of flexible devices
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Enables production of billions of nano-structures in a single process
Development Milestones
The Opportunity
Patent StatusGranted US 6,783,849; US 6,316,098; US 6,808,803